Electronic Packaging Science and Technology. King-Ning Tu
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Название: Electronic Packaging Science and Technology

Автор: King-Ning Tu

Издательство: John Wiley & Sons Limited

Жанр: Химия

Серия:

isbn: 9781119418337

isbn:

СКАЧАТЬ technology and AI applications are with us and they exert an unlimited impact and change to our society.

      There were many reasons of Japan’s failure, such as the critical change in currency exchange rate between yuan and dollar, and also the heavy punishments of Fujitsu by United States. However, Japan has recently joined TSMC to form an advanced electronic packaging factory in Japan to maintain its impact. The weaker and weaker presence of England and France is because of the insufficient financial support on semiconductor technology due to socialism. They tended to support rather uniformly the popular needs of society, but did not concentrate on supporting semiconductor technology. Today, to build a Si‐based transistor factory will take 3–5 billion US dollars, so fewer and fewer countries can afford it. Russia is simply poor. Samsung in Korea has had the government’s focused support to do so. TSMC in Taiwan is unique that it takes orders from all over the world to make VLSI devices, so it knows the major trend of the technology. Thus, it can spend the money it earned to keep improving the technology with innovation. For example, the technique of immersion lithography has enabled TSMC to lead the manufacturing of nanoscale semiconductor devices for the past five generations. Now, we are having the 5 nm node of nanotechnology, and 3 nm and 2 nm nodes are coming.

      Some experts in China commented that China might take 10 years to catch up. No reason was given why it will take so long! On the other hand, China has been very successful in high‐speed train and satellite technology. When China can make transistors as cheap as those made in United States, it is a sign that China has caught up. A plausible reason is given below.

Photo depicts a part of the device structure of the mainframe computer in 2002. The size of the module is about 10 × 10 cm.

Schematic illustration of the petals of flower, which shows the required functions in 4G and 5G communication technology.
Primary requirements:End‐to‐end latency (mille sec)Peak data rate (mobility, km/h)Traffic volume density (tens of Tbps/km2)Density of base stations (104/km2)Internet of everythingEnergy efficiency
Secondary requirements:Security and reliabilityLow cost

      In 2014, it was already predicted that around 2020, the 5G technology will be widely available. However, the company, Huawei in China, announced that its 5G technology is ready in 2019, ahead of everyone. It became a critical issue in the trade war between China and United States. The latter has put Huawei on its entity list or ban list. The hardware in 5G consists of satellites, servers, optical fiber lines, base stations, cell phones, and terminal sensors, and the software consists of various mobile internets, such as Android of Google. Huawei is especially good at making base stations.

      Data and signals can be transmitted СКАЧАТЬ