Industry 4.1. Группа авторов

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      13 13 Tag, P.‐H. and Zhang, M.‐T. (2006). e‐Manufacturing in the semiconductor industry. IEEE Robotics and Automation Magazine 13 (4): 25–32. https://doi.org/10.1109/MRA.2006.250570.

      14 14 Cheng, F.‐T., Tsai, W.‐H., Wang, T.‐L. et al. (2010). Advanced e‐Manufacturing model. IEEE Robotics and Automation Magazine 17 (1): 71–84. https://doi.org/10.1109/MRA.2010.935796.

      15 15 Hung, M.‐H., Cheng, F.‐T., and Yeh, S.‐C. (2005). Development of a web‐services‐based e‐diagnostics framework for the semiconductor manufacturing industry. IEEE Transactions on Semiconductor Manufacturing 18 (1): 122–135. https://doi.org/10.1109/TSM.2004.836664.

      16 16 Hung, M.‐H., Wang, T.‐L., Hsu, F.‐Y. et al. (2008). Development of an interface C framework for semiconductor e‐diagnostics systems. Robotics and Computer‐Integration Manufacturing 24 (3): 370–383. https://doi.org/10.1016/j.rcim.2007.02.020.

      17 17 TechTarget (2007). Manufacturing Execution Systems. http://www.bitpipe.com/rlist/term/Manufacturing‐Execution‐Systems.html ().

      18 18 Lin, W.Y., Hsu, R., and Chiu, Y.T. (2005). Systems and methods for determining production availability. US Patent 20,070,016,318, filed 15 July 2005 and issued 18 Jan 2007.

      19 19 Lee, H. and Whang, S. (2006). Taiwan semiconductor manufacturing company: the semiconductor services company. Stanford Graduate School of Business case: GS‐40. https://www.gsb.stanford.edu/faculty‐research/case‐studies/taiwan‐semiconductor‐manufacturing‐company‐semiconductor‐services (accessed 28 August 2020).

      20 20 SEMI (2020). SEMI EDA standards: E120, E125, E132, E134. www.semi.org ().

      21 21 SEMI E125 (2014). SEMI E125 ‐ Specification for Equipment Self Description (EqSD). USA: SEMI https://bit.ly/3j5C2Bj (accessed 1 September 2020).

      22 22 SEMI E132 (2019). SEMI E132 ‐ Specification for Equipment Client Authentication and Authorization. USA: SEMI https://bit.ly/3haoJgS (accessed 1 September 2020).

      23 23 SEMI E134 (2019). SEMI E134 ‐ Specification for Data Collection Management. USA: SEMI https://bit.ly/3fCBWPq (accessed 1 September 2020).

      24 24 SEMI E133 (2018). SEMI E133 ‐ Specification for Automated Process Control Systems Interface. USA: SEMI https://bit.ly/2ESLuIF (accessed 17 Aug 2020).

      25 25 International SEMATECH Manufacturing Initiative (2005). Interface C Requirements of e‐Diagnostics Guidebook (version 2.1).

      26 26 Weber, A. (2007). Virtual metrology and your technology watch list: ten things you should know about this emerging technology. Future Fab International 22 (4): 52–54.

      27 27 Chang, J. and Cheng, F.‐T. (2005). Application development of virtual metrology in semiconductor industry. Proc. 31st Annual Conference of the IEEE Industrial Electronics (IECON 2005), Raleigh, U.S.A. (6‐10 Nov 2005). Raleigh, USA: IEEE.

      28 28 Moyne, J., del Castillo, E., and Hurwitz, A.M. (2001). Run‐to‐Run Control in Semiconductor Manufacturing. Boca Raton, FL: CRC.

      29 29 Madhavan, R.(2004). Changing economics of chip design. FSA Presentation.

      30 30 Werr, P. (2015). How Industry 4.0 and the internet of things are connected. https://bit.ly/2YSX8dr (accessed 17 Aug 2020).

      31 31 Ferber, S. (2012). Industry 4.0 – Germany takes first steps toward the next industrial revolution. https://bit.ly/3lEQe5B (accessed 17 Aug 2020).

      32 32 Jazdi, N. (2014). Cyber physical systems in the context of Industry 4.0. IEEE International Conference on Automation, Quality and Testing, Robotics, Cluj‐Napoca, Romania (22‐24 May 2014). Cluj‐Napoca, Romania: IEEE.

      33 33 Perera, C., Liu, C.H., Jayawardena, S. et al. (2015). A survey on internet of things from industrial market perspective. Access, IEEE 2: 1660–1679. https://doi.org/10.1109/ACCESS.2015.2389854.

      34 34 Wan, J., Chen, M., Xia, F. et al. (2013). From machine‐to‐machine communications towards cyber‐physical systems. Computer Science and Information Systems 10 (3): 1105–1128. https://doi.org/10.2298/CSIS120326018W.

      35 35 Gubbi, J., Buyya, R., Marusic, S. et al. (2013). Internet of things (IoT): a vision, architectural elements, and future directions. Future Generation Computer Systems 29 (7): 1645–1660. https://doi.org/10.1016/j.future.2013.01.010.

      36 36 Colombo, A.W., Bangemann, T., Karnouskos, S. et al. (2014). Industrial cloud‐based cyber‐physical systems, The IMC‐AESOP Approach. Switzerland: Springer International Publishing.

      37 37 Tsai, C.‐W., Lai, C.‐F., Chiang, M.‐C. et al. (2014). Data mining for internet of things: a survey. Communications Surveys & Tutorials, IEEE 16 (1): 77–97. https://doi.org/10.1109/SURV.2013.103013.00206.

      38 38 Perera, C., Zaslavsky, A., Liu, C.‐H. et al. (2014). Sensor search techniques for sensing as a service architecture for the internet of things. IEEE Sensors Journal 14 (2): 406–420. https://doi.org/10.1109/JSEN.2013.2282292.

      39 39 Xia, F., Vinel, A., Gao, R. et al. (2011). Evaluating IEEE 802.15. 4 for cyber‐physical systems. EURASIP Journal on Wireless Communications and Networking 2011: 596397. https://doi.org/10.1155/2011/596397.

      40 40 Sánchez López, T., Ranasinghe, D.C., Harrison, M. et al. (2012). Adding sense to the internet of things. Personal and Ubiquitous Computing 16 (3): 291–308. https://doi.org/10.1007/s00779‐011‐0399‐8.

      41 41 Miorandi, D., Sicari, S., De Pellegrini, F. et al. (2012). Internet of things: vision, applications and research challenges. Ad Hoc Networks 10 (7): 1497–1516. https://doi.org/10.1016/j.adhoc.2012.02.016.

      42 42 Huang, H.‐C., Lin, Y.‐C., Hung, M.‐H. et al. (2015). Development of cloud‐based automatic virtual metrology system for semiconductor industry. Robotics and Computer‐Integrated Manufacturing 34: 30–43. https://doi.org/10.1016/j.rcim.2015.01.005.

      43 43 СКАЧАТЬ