Industry 4.1. Группа авторов

Чтение книги онлайн.

СКАЧАТЬ ICT Information and Communication Technology iFA Intelligent Factory Automation IoT Internet of Things IP Internet Protocol Address IPM Intelligent Predictive Maintenance ISMT International SEMATECH IT Information Technology ITRS International Technology Roadmap of Semiconductor IYM Intelligent Yield Management KSA Key‐variable Search Algorithm L2L Lot‐to‐Lot MC Mass Customization MCS Material Control System MES Manufacturing Execution System MP Mass Production MPS Master Production Schedule NACFAM National Coalition for Advanced Manufacturing O2D Order‐to‐Delivery OEE Overall Equipment Effectiveness PdM Predictive Maintenance PO Purchase Order R2R Run‐to‐Run RD Research and Development RDL Re‐Distribution Layer RM Recipe Management RUL Remaining Useful Life SC Supply Chain SECS SEMI Equipment Communications Standard SOAP Simple Object Access Protocol SPC Statistical Process Control SSL Secure Sockets Layer T2M Time‐to‐Market tsmc Taiwan Semiconductor Manufacturing Company UBM Under Bump Metallurgy VM Virtual Metrology W2W Wafer‐to‐Wafer W2W Workpiece‐to‐Workpiece WIP Work in Process WSDL Web Services Description Language YES Yield Enhancement System YMS Yield Management System ZD Zero Defects

References

      1 1 SEMATECH (1998). Computer Integrated Manufacturing (CIM) Framework Specification Version 2.0. SEMATECH Technology Transfer # # 93061697J‐ENG. https://bit.ly/3hDCvJH (accessed 27 Aug 2020).

      2 2 Cheng, F.‐T., Shen, E., Deng, J.‐Y. et al. (1999). Development of a system framework for the computer‐integrated manufacturing execution system: a distributed object‐oriented approach. International Journal of Computer Integrated Manufacturing 12 (5): 384–402. https://doi.org/10.1080/095119299130137.

      3 3 Cheng, F.‐T., Chang, C.‐F., and Wu, S.‐L. (2004). Development of holonic manufacturing execution systems. Journal of Intelligent Manufacturing 15 (2): 253–267. https://doi.org/10.1023/B:JIMS.0000018037.63935.a1.

      4 4 International SEMATECH (2002). Equipment Engineering Capabilities (EEC) guidelines, v2.5. https://reurl.cc/Q3dR2o (accessed 17 Aug 2020).

      5 5 Su, Y.‐C., Cheng, F.‐T., Hung, M.‐H. et al. (2006). Intelligent prognostics system design and implementation. IEEE Transactions on Semiconductor Manufacturing 19 (2): 195–207. https://doi.org/10.1109/TSM.2006.873512.

      6 6 Harrison, P. (2015). An introduction to supply chain management. https://reurl.cc/Y61Yv0 (accessed 17 Aug 2020).

      7 7 NEVEM‐workgroup (1989). Performance Indicators in Logistics. Bedford: IFS.

      8 8 Cheng, F.‐T., Yang, H.‐C., and Lin, J.‐Y. (2004). Development of holonic information coordination systems with failure‐recovery considerations. IEEE Transactions on Automation Science and Engineering 1 (1): 58–72. https://doi.org/10.1109/TASE.2004.829350.

      9 9 Chang, J. and Cheng, F.‐T. (2005). Engineering‐chain requirements for semiconductor industry. Proceedings of the 2005 IEEE Conference on Automation Science and Engineering, Edmonton, Canada (1‐2 Aug 2005). USA: IEEE.

      10 10 Chang, J. and Cheng, F.‐T. (2005). Framework development of an Engineering‐Chain‐Management‐System for the semiconductor industry. Proceedings of the Thirteenth International Symposium on Temporal Representation and Reasoning, Perth, Australia (10‐12 Aug 2005). USA: IEEE.

      11 11 Cheng, F.‐T., Chen, Y.‐L., and Chang, J.Y.‐C. (2012). Engineering chain: a novel semiconductor engineering collaboration model. IEEE Transactions on Semiconductor Manufacturing 25 (3): 394–407. https://doi.org/10.1109/TSM.2012.2191626.

СКАЧАТЬ